1. 2. 3. material content data sheet sales product name tle4964-6m issued 28. august 2013 ma# MA001069856 package pg-sot23-3-15 weight* 9.82 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.350 3.56 3.56 35596 35596 leadframe inorganic material silicon 7440-21-3 0.001 0.01 73 non noble metal titanium 7440-32-6 0.004 0.04 367 non noble metal chromium 7440-47-3 0.011 0.11 1101 non noble metal copper 7440-50-8 3.590 36.56 36.72 365605 367146 wire noble metal gold 7440-57-5 0.018 0.18 0.18 1848 1848 encapsulation organic material carbon black 1333-86-4 0.054 0.55 5463 plastics epoxy resin - 1.153 11.75 117460 inorganic material silicondioxide 60676-86-0 4.157 42.34 54.64 423401 546324 leadfinish non noble metal tin 7440-31-5 0.150 1.52 1.52 15241 15241 plating noble metal silver 7440-22-4 0.149 1.51 1.51 15133 15133 glue plastics epoxy resin - 0.032 0.33 3275 noble metal silver 7440-22-4 0.152 1.54 1.87 15437 18712 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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